Pal-AHK vs AHK-Cu
Side-by-side comparison of key properties, dosing, and research.
- Summary
- Pal-AHK is the palmitoylated form of the AHK-Cu copper tripeptide, created by attaching a palmitic acid chain to enhance skin penetration and lipid bilayer affinity. The palmitoyl modification significantly improves dermal bioavailability compared to unmodified AHK, making it particularly effective in anti-aging and hair growth formulations.
- AHK-Cu is a copper tripeptide composed of alanine, histidine, and lysine chelated to copper. Distinct from GHK-Cu, AHK-Cu exhibits strong affinity for hair follicle receptors and demonstrates potent hair growth stimulation alongside wound healing and skin regeneration properties.
- Half-Life
- Extended (lipid depot effect in stratum corneum)
- Hours (topical, variable by formulation)
- Admin Route
- Topical
- Topical, Scalp application, Subcutaneous (research)
- Research
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- Typical Dose
- 0.01–0.05% in formulation
- 0.01–0.1% concentration
- Frequency
- Once or twice daily
- Once or twice daily
- Key Benefits
- Enhanced skin penetration vs. unmodified AHK-Cu
- Stimulates dermal collagen and elastin production
- Promotes hair follicle anagen phase
- Antioxidant and wound healing activity
- Firming and plumping effect on aging skin
- Improved bioavailability via lipid bilayer incorporation
- Stimulates hair follicle growth and reduces shedding
- Increases dermal papilla cell proliferation
- Promotes wound healing and skin regeneration
- Antioxidant protection via superoxide dismutase activation
- Improves skin elasticity and firmness
- Supports collagen and elastin production
- Side Effects
- Generally well-tolerated
- Mild irritation at high concentrations in sensitive skin
- Possible comedogenicity at very high palmitate concentrations (formulation-dependent)
- Generally well-tolerated topically
- Mild scalp irritation or redness in sensitive individuals
- Possible temporary hair shedding phase at treatment initiation
- Copper accumulation with excessive systemic use (rare)
- Stacks With
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